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SURFACE MOUNT LED LAMP 0603 (0.6 mm Height) Low VF Blue PACKAGE DIMENSIONS 0.071 (1.8) 0.055 (1.4) 0.035 (0.9) 0.028 (0.7) QTLP601C-EB TOP 0.047 (1.2) 0.004 (0.1) 0.024 (0.6) SIDE 0.039 (1.0) CATHODE BOTTOM POLARITY NOTE: + APPLICATIONS * Keypad backlighting * Push-button backlighting * LCD backlighting Dimensions for all drawings are in inches (mm). DESCRIPTION This surface mount chip LED is designed to fit industry standard footprint. Small size, low profile and wide viewing angle make this LED an ideal choice for backlighting applications and panel illumination. This device utilizes an InGaN/Sapphire blue LED. FEATURES * Miniature footprint - 1.6(L) X 0.8(W) X 0.6(H) mm * Wide viewing angle of 100 * Water clear optics * Moisture-proof packaging * Available in 0.315" (8mm) width tape on 7" (178mm) diameter reel; 2,000 units per reel (c) 2002 Fairchild Semiconductor Corporation Page 1 of 6 7/16/02 SURFACE MOUNT LED LAMP 0603 (0.6 mm Height) Low VF Blue ABSOLUTE MAXIMUM RATINGS (TA = 25C unless otherwise specified) Parameter Operating Temperature Storage Temperature Lead Soldering Time Continuous Forward Current Peak Forward Current (f = 1.0 KHz, Duty Factor = 1/10) Reverse Voltage Power Dissipation Symbol TOPR TSTG TSOL IF IFM VR PD Rating -40 to +85 -40 to +90 260 for 5 sec 30 100 5 80 Unit C C C mA mA V mW QTLP601C-EB ELECTRICAL / OPTICAL CHARACTERISTICS (TA =25C) Part Number Luminous Intensity (mcd) Bin I1 Bin I2 Forward Voltage (V) Bin V1 Bin V2 Dominant Wavelength (nm) Bin W1 Bin W2 Bin W3 Spectral Line Half Width (nm) Viewing Angle () 465 - 470 470 - 475 475 - 480 35 120 IF = 5 mA IF = 5 mA IF = 5 mA 2.75 - 2.95 2.95 - 3.15 IF = 5 mA 8 - 16 13 - 26 IF = 5 mA QTLP601CEB.7778D Condition (c) 2002 Fairchild Semiconductor Corporation Page 2 of 6 7/16/02 SURFACE MOUNT LED LAMP 0603 (0.6 mm Height) Low VF Blue TYPICAL PERFORMANCE CURVES Fig. 1 Forward Current vs. Forward Voltage 100 1.4 QTLP601C-EB Fig. 2 Relative Luminous Intensity vs. DC Forward Current RELATIVE LUMNOUS INTENSITY (NORMALIZED AT 20 mA) IF - FORWARD CURRENT (mA) 1.2 1.0 0.8 0.6 0.4 0.2 0.0 10 1 0.1 2.00 2.50 3.00 3.50 4.00 0 10 20 30 40 VF - FORWARD VOLTAGE (V) IF - FORWARD CURRENT (mA) Fig. 3 Relative Intensity vs. Peak Wavelength 1.0 RELATIVE INTENSITY 0.5 0 300 350 400 450 500 550 600 650 700 750 WAVELENGTH (nm) Fig.5 Maximum Forward Current vs. Ambient Temperature 50 Fig.4 Radiation Diagram -20 -30 -40 -50 -60 -70 -80 -90 1.0 0.8 0.6 0.4 0.2 0 0.2 0.4 0.6 0.8 1.0 -10 0 10 20 30 40 50 60 70 80 90 IF - FORWARD CURRENT (mA) 40 30 20 10 0 0 20 40 60 80 100 REL. LUMINOUS INTENSITY (%) TA - AMBIENT TEMPERATURE (C) (c) 2002 Fairchild Semiconductor Corporation Page 3 of 6 7/16/02 SURFACE MOUNT LED LAMP 0603 (0.6 mm Height) Low VF Blue RECOMMENDED PRINTED CIRCUIT BOARD PATTERN 0.033 (0.85) 0.031 (0.80) 0.031 (0.80) QTLP601C-EB 0.039 (1.00) RECOMMENDED IR REFLOW SOLDERING PROFILE 5 sec MAX soldering time 240 C MAX +5 C/s MAX -5 C/s MAX 60 - 120 sec Preheating 120 - 150 C MAX (c) 2002 Fairchild Semiconductor Corporation Page 4 of 6 7/16/02 SURFACE MOUNT LED LAMP 0603 (0.6 mm Height) Low VF Blue TAPE AND REEL DIMENSIONS 8.4 +1.5 -0.0 QTLP601C-EB 11.0 5 0. 2.5 +0.5 -0.0 O12.75 +0.25 -0.0 Progressive direction 1.75 2.00.05 4.0 O1.55.05 0.230.1 2.5 0 0.5 O62.00.5 O1801 3.50.05 4.0 0.9 8.0 0.7 Dimensional tolerance is 0.1mm unless otherwise specified Angle: 0.5 Polarity Unit: mm 1.80.1 (c) 2002 Fairchild Semiconductor Corporation Page 5 of 6 7/16/02 SURFACE MOUNT LED LAMP 0603 (0.6 mm Height) Low VF Blue QTLP601C-EB DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. (c) 2002 Fairchild Semiconductor Corporation Page 6 of 6 7/16/02 |
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